Principle of LED Crystal Fixing Machine_ Operation Steps of LED Crystal Fixing Machine

LED crystal fixing machine is a professional crystal fixing machine for LED products. It is controlled by computer and equipped with CCD image sensing system. Firstly, the CCD system scans and determines the correct path, then inputs the set programming program, and easily press the button to realize the whole work process: first fix the crystal of the product to be fixed on the fixture, point red glue, and absorb the LED through the suction nozzle, Then fix the LED on the product. It should be noted that the product of chanyouguang automatic crystal fixing machine after crystal fixing should be cured within 1 to 2 hours.

Principle of LED crystal fixing machine:

The feeding mechanism transfers the PCB board to the working position on the fixture, and the dispensing mechanism dispensing the position where the PCB needs to be bonded to the wafer. Then, the bonding arm moves from the origin position to the wafer suction position, and the wafer is placed on the expander wafer disk supported by the film. After the bonding arm is in place, the suction nozzle moves downward and upward to jack up the wafer. After picking up the wafer, the bonding arm returns to the origin position, the bonding arm moves from the origin position to the bonding position, the suction nozzle bonds the wafer downward, and the bonding arm returns to the origin position again, which is a complete bonding process.

Operation steps of LED crystal fixing machine:

1. The feeding mechanism transfers the PCB board to the working position on the fixture. First, the dispensing mechanism dispenses the glue at the position where the PCB needs to bond the wafer. Then, the bonding arm moves from the origin position to the wafer suction position. The wafer is placed on the expander wafer disc supported by the film. After the bonding arm is in place, the suction nozzle moves downward and moves upward to jack up the wafer, After picking up the wafer, the bonding arm returns to the origin position (leakage detection position), the bonding arm moves from the origin position to the bonding position, the suction nozzle bonds the wafer downward, and the bonding arm returns to the origin position again, which is a complete bonding process.

2. After one beat of the automatic crystal fixing machine is completed, the data of the next position of the wafer is detected by machine vision, and the data is transmitted to the wafer disc motor, so that the motor can move the next wafer to the aligned wafer picking position after walking the corresponding distance.

3. The dispensing bonding position of the PCB board is the same process until all dispensing positions on the PCB board are bonded with the wafer, then the transmission mechanism moves the PCB board from the workbench, installs a new PCB board, and starts the working cycle of the new cuitao Xinyida wire bonding machine.

How to adjust the parameters of LED crystal fixing machine when LED crystal fixing breaks?

The suction nozzle height and solid crystal height of the machine are directly controlled by the parameters in the machine computer. Large parameters and small suction height; The parameters are small, and the fixing height is large. Whether the chip is damaged or not is directly affected by the fixing height parameters of the machine. The main causes of adverse phenomena are: large machine parameters, low solid height and excessive stress on the chip, resulting in chip damage.

Adjust the machine parameters, properly raise the vigilance of the suction nozzle height or solid crystal height, adjust the suction nozzle height in the first "pick level" in the "bond head menu" in the "setup" mode of the machine, and then adjust the solid crystal height in the second "bond level".